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Thermoplastic polyimide resin - List of Manufacturers, Suppliers, Companies and Products

Thermoplastic polyimide resin Product List

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Introduction of exhibited products at "Chemical Material Japan 2020"

Introduction of exhibited products at "Chemical Material Japan 2020"

Polyimide resin, which is expected to be utilized in various fields including 5G-related applications and aerospace. Product materials are being provided.

Our company will be exhibiting at "Chemical Materials Japan 2020," which will be held online from October 19 to November 18, 2020. 【Exhibited Products Features】 ■ Thermoplastic Polyimide Resin 'Supreme TO65' - Excellent moldability with a Tg of 185°C and a Tm of 323°C - Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Heat-Resistant Transparent Polyester Resin 'ALTESTER Series' - Developed a new grade with a glass transition temperature up to 50°C higher than PET - Currently developing a new grade with crystallinity - Maintains transparency while improving impact resistance ■ Thermosetting Resin 'CYTESTER' - Cures by forming a triazine ring Excellent processability, with high glass transition temperature, low thermal expansion, and low dielectric properties after curing ■ Special Polyol 'SPG (Spiroglycol)' - Symmetrical and stable molecular structure - Incorporating into polymers enhances heat resistance, impact resistance, hardness, and moldability ■ Special Polyol 'DOG (Dioxanediol)' - Can impart flexibility when incorporated into polymers *For more details about each product, please refer to the materials or feel free to contact us.

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Thermoplastic polyimide resin "Saprime"

Thermoplastic polyimide resin "Saprime"

A thermoplastic polyimide resin that combines unprecedented moldability and heat resistance.

"Suprem" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK, and combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, and it has a wide range of applications such as CFRP matrix resin, CFRP toughness modifiers, compounds, and electrical and electronic uses, leveraging its characteristics. [Features] ■ Crystalline thermoplastic polyimide (pellets, powder) ■ Insoluble in solvents ■ High heat resistance, high strength ■ Easy moldability ■ Reflow resistant ■ Low dielectric, high lubricity *For more details, please refer to the PDF document or feel free to contact us.

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Examples of Suprem Film Molding

Examples of Suprem Film Molding

Introducing examples of film molding of Surprim, boasting low dielectric properties and high toughness, with Tg of 185°C and Tm of 323°C!

Here is an introduction to examples of film molding using "Saprime." "Saprime" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications. 【Features】 ■ Low dielectric properties ■ Low water absorption ■ High visibility ■ High toughness ■ High Tg (185°C) ■ Crystalline film *For more details, please refer to the PDF materials or feel free to contact us.

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『Therplim』 Low Friction Grade

『Therplim』 Low Friction Grade

For complex shape members and high-performance molded members!

Introducing the crystalline thermoplastic polyimide "Therplim Fiber Reinforced Grade". It is suitable for applications that require high Tg (185℃) as an alternative to super engineering plastics such as PEEK.

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Thermoplastic polyimide resin Therplim powder filler application for toughness modifier in CFRP.

Thermoplastic polyimide resin Therplim powder filler application for toughness modifier in CFRP.

Improved toughness, enhanced sliding properties, and low dielectric effects from various powder additives! Introduction to powder filler applications.

Introducing the powder filler application of Therplim (filler). The effects of adding powder include improved heat resistance, enhanced mechanical properties, and improved sliding properties. For example, it provides toughness and reduces weight for high heat-resistant CFRP. 【Effects of Adding Powder】 ■ Improved heat resistance ■ Increased toughness ■ Enhanced mechanical properties ■ Improved sliding properties ■ Increased chemical resistance ■ Low dielectric * For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide resin "Saprime Powder"

Thermoplastic polyimide resin "Saprime Powder"

Drive blendable! Micronized powder of heat-resistant polyimide resin that can also be processed by melting.

"Saprime" is a thermoplastic polyimide resin that demonstrates a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic uses. "Saprime Powder" is a fine powder of heat-resistant polyimide resin. Despite being a fine particle, it has a uniform particle size and can be melt-formed above the melting point. [Features] - Crystalline thermoplastic polyimide - Insoluble in solvents - Fine powder with a sharp particle size distribution - Milky white powder - Can be drive blended - Low dielectric, high heat resistance, and meltable *For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide resin "Surprim Sliding Grade TS Series"

Thermoplastic polyimide resin "Surprim Sliding Grade TS Series"

The Suprem Sliding Grade "TS2400W" achieves higher strength, elasticity, lower wear, and a lower dynamic friction coefficient than the PEEK sliding grade!

The Suprem TS series is a sliding grade for injection molding that uses Suprem as the base resin. The carbon fiber and whisker reinforced grades "TS2400W" and "TS2401W" have higher strength and elasticity than PEEK. 【Features】 ■ Low wear and low friction coefficient - In particular, "TS2400W" has lower wear and a lower dynamic friction coefficient than PEEK sliding grades. ■ Good stability of dynamic friction coefficient - Stable dynamic friction coefficient at 23°C and 120°C. ■ Good sliding properties even at high temperatures - "TS2400W" and "TS2401W" exhibit excellent sliding properties even at high temperatures (120°C). ■ Good flowability during molding - Easy to mold thin-walled and small molded products. *For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide Therplim

Thermoplastic polyimide Therplim

Polyimide resin that has both moldability and heat resistance.

"Therplim" shows a well-balanced glass transition point (Tg185 ℃) and melting point (Tm323 ℃) compared to super engineering plastics such as PEEK. A crystalline TPI that maintains a high Tg while lowering its melting point. We can provide powder and pellets. 【Features】 ・Crystalline resin ・high strength ・high heat resistance ・high solvent resistance ・low dielectric constant ・easy molding processing ・Insoluble in solvent ※For details, please see the PDF document or feel free to contact us.

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Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.

Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]

Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]

This is a resin that combines excellent moldability and heat resistance, available for use in various fields such as industrial parts, aerospace, automotive, and energy!

Mitsubishi Gas Chemical's "Therplim" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature and melting point, along with high strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability. Samples are available upon request! 【Features】 ■ Excellent moldability with a glass transition temperature (Tg) of 185 degrees and a melting point (Tm) of 323 degrees ■ High strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability ■ Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Used in 5G FCCL, test sockets, various sliding compound grades, CFRP, and toughness modifiers *For more details, please request documentation or download the PDF data.

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Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.

Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.

Suprem (TPI) can be used for alloying with various super engineering plastics (TPI, PEI, PES, PPSU, LCP, PEEK).

Introducing the applications of Suprem's super engineering plastics alloy. Suprem is a crystalline super engineering plastic with high heat resistance (Tg: 185°C, Tm: 323°C) and high fluidity, allowing for a high content of fillers and other additives. By leveraging Suprem's characteristics of high heat resistance, crystallinity, low water absorption, and flexibility, improvements in various properties can be expected through alloying with various super engineering plastics. 【Features】 ■ Alloyed product of crystalline thermoplastic polyimide (TPI) resin ■ Crystallinity derived from Suprem is maintained even in alloyed products ■ Expected reinforcement effects through fiber reinforcement *For more details, please refer to the PDF document or feel free to contact us.

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EXTEM XH series for optical products related to 5G.

EXTEM XH series for optical products related to 5G.

Attention is also drawn to the ability to handle complex lens shapes and high productivity.

The EXTEM XH series developed by SABIC has been increasingly used in optical communication transceiver lenses and optical sensor receiving lenses, which are gaining attention in recent years for applications such as 5G. For the same applications, the company's ULTEM RESIN products (such as ULTEM 1010 and ULTEM DT1810EV) have been widely adopted by many customers and components around the world, but they were not compatible with lead-free soldering processes. This material, which is compatible with that process, is attracting attention for its ability to accommodate complex lens shapes and its high productivity compared to glass and thermosetting resin lenses. Additionally, it has gained recognition as a high-heat-resistant optical thermoplastic resin that was first registered in the Zemax OpticsStudio material database in March 2019, providing designers of optical sensors and lenses with a new groundbreaking material option beyond glass and epoxy resins. [Application Examples] Adopted for infrared sensor lenses used in proximity sensors and gesture recognition in electronic products such as smartphones and gaming consoles. For inquiries and material requests, please visit this site: https://sjpn1971.plabase.com/

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SABIC ULTEM and EXTEM

SABIC ULTEM and EXTEM

Value in die-cast parts and stock shape materials

Did you know that Highheat ULTEM and EXTEM powders can be used as additives for optimizing the manufacturing processes of thermoplastic polyimide (TPI) stock shape products (rods, sheets) as well as die-cast components such as connectors, seal rings, screws, and bearings? Our powders help optimize viscosity, reduce curing time, and minimize product defects such as bubbles. They are also inherently compatible with TPI. Go to our dianhydrides and imides webpage: https://lnkd.in/gtGGF8X For inquiries and requests for materials, please visit this site: https://sjpn1971.plabase.com/

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